PANEL-LEVEL GLASS BASED EMBEDDED SILICON BRIDGE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Smart overview of the Invention

The patent application describes a semiconductor package that integrates a glass substrate with a through-glass via, connecting two redistribution layers. This structure supports the inclusion of a bridge chip within the glass substrate, facilitating the connection between two semiconductor chips. The package aims to enhance the performance and reliability of electronic devices by enabling a compact and efficient design.

Components

The semiconductor package comprises several key components:

• First Redistribution Layer: Includes an insulating layer, wiring pattern, and via for electrical connections.
• Second Redistribution Layer: Similar to the first, it has an insulating layer, wiring pattern, and via, positioned on the glass substrate.
• Glass Substrate: Positioned between the redistribution layers, featuring a through-glass via for connectivity.
• Bridge Chip: Embedded within the glass substrate to electrically link the two semiconductor chips.

Manufacturing Method

The method of manufacturing involves several steps:

• Forming the first redistribution layer on a carrier substrate.
• Positioning the glass substrate with a through-glass via on the first redistribution layer.
• Incorporating the bridge chip within the glass substrate.
• Developing the second redistribution layer on the glass substrate.
• Attaching the first and second semiconductor chips to the second redistribution layer.

Technical Advantages

This design addresses the industry's demand for smaller, lighter, and more efficient electronic devices. By incorporating a glass-based interposer and a bridge chip, the package supports high performance and capacity while maintaining reliability. The innovative structure also contributes to better power management within the semiconductor package, essential for modern electronic applications.

Applications and Future Potential

The described semiconductor package can be utilized in various electronic systems, enhancing their performance and efficiency. The glass-based design opens avenues for further miniaturization and integration of complex functionalities in electronic devices. As technology continues to evolve, such innovations will likely play a crucial role in the development of next-generation electronics.