US20260013252
2026-01-08
Electricity
H10F39/8063
The patent application describes a semiconductor package designed to integrate multiple types of chips into a compact form. This package consists of a package substrate, an intermediate substrate, and an optical engine unit. The optical engine unit includes a photonic integrated circuit (PIC) chip and an electronic integrated circuit (EIC) chip, both of which are surrounded by a multi-insulating layer and topped with a transparent support layer. This configuration aims to meet the growing demand for high-speed, miniaturized electronic components.
The semiconductor package is composed of several key components: a package substrate, an intermediate substrate, an optical engine unit, a logic device, and a memory device. The optical engine unit is particularly notable for its integration of a PIC chip and an EIC chip on a first redistribution substrate. These components are enveloped by a multi-insulating layer, which provides protection and structural support, while a transparent support layer enhances the optical properties of the package.
The manufacturing process of the semiconductor package involves several steps. Initially, the optical engine unit is constructed by layering a PIC chip and an EIC chip on a first redistribution substrate, followed by the application of multi-insulating layers and a transparent support layer. Subsequently, this unit is mounted on an intermediate substrate, alongside a logic device and a memory device, which are positioned adjacent to each other. Finally, the intermediate substrate is mounted onto the package substrate, completing the assembly.
One of the innovative aspects of this semiconductor package is the use of a multi-insulating layer that includes a first and second insulating layer, enhancing the integration of the optical and electronic components. Additionally, the transparent support layer may incorporate a microlens to improve optical performance. These features collectively contribute to the package's reduced size and increased functionality, making it suitable for high-performance applications.
The described semiconductor package is designed to address the needs of modern electronic devices that require compact, high-speed, and multifunctional components. By integrating PIC and EIC chips within a single package, it offers improved performance and reliability. This configuration is particularly beneficial for applications in telecommunications, data centers, and advanced computing systems, where space and efficiency are critical.