MULTILEVEL INVERTER SYSTEM INCLUDING X-TYPE MULTILEVEL CONVERTERS HAVING MUTUAL INDUCTANCE CANCELLATION

Smart overview of the Invention

The patent describes a multi-phase power inverter designed for electric propulsion systems, incorporating multiple X-type multilevel power converters. These converters are structured as solid-state integrated circuits. Each converter features DC power buses, AC power buses, clamping diodes, and a power module substrate on an insulating substrate with an adjacent heat sink. The semiconductor switches within the module are coplanar, optimizing the layout for improved performance.

Design and Configuration

This system integrates power semiconductor devices using both active and passive semiconductor dies to achieve mutual inductance cancellation. The topology minimizes parasitic inductance, enhancing the efficiency of the multi-phase power inverter. The design is particularly suited for vehicles with electrified propulsion systems, such as electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs), by reducing unwanted inductance.

Components and Topology

The inverter comprises several X-type multilevel power converters, each configured as solid-state ICs. These converters include components like semiconductor switches and busbars, forming a network that facilitates current flow. The topology is designed to minimize stray and loop inductance by employing magnetic field cancellation, achieved through strategic arrangement of buses and converters.

Cooling and Efficiency

The arrangement of converters with laterally sectioned elements allows for either single-sided or double-sided cooling, reducing thermal impedance. This configuration lowers stray inductance, resulting in decreased switching loss, electromagnetic interference (EMI), and device thermal stress. This efficient design enhances the overall performance and longevity of the power inverter system.

Interconnections and Layout

The power inverter's interconnections may include wire bonding, ribbon bonding, clip bonding, and direct copper bus bonding. The buses are arranged coplanar and parallel, extending past the edges of the converter to optimize space and performance. The design ensures that the semiconductor switches and clamping diodes are coplanar, contributing to the system's compactness and efficiency.