US20260150758
2026-05-28
Electricity
H10W90/00
The semiconductor package features a sophisticated integration of electronic and photonic components, aiming for enhanced functionality and reduced size. It includes a redistribution substrate supporting an electronic integrated circuit (EIC) chip and a photonic integrated circuit (PIC) chip. The integration facilitates efficient optical signal transmission, leveraging a novel structure that aligns a first waveguide (WG) in the optical path bridge chip with a second WG in the PIC chip. This alignment allows for vertical overlap, promoting seamless signal flow through the package.
The package's structure is meticulously designed with multiple layers and components. On the redistribution substrate, the EIC chip is positioned, featuring a through electrode for electronic signal transmission. The optical path bridge chip is placed horizontally on the EIC chip, containing a first WG. The PIC chip, which includes a second WG, is mounted on both the EIC chip and the optical path bridge chip. A transparent support layer is added on top, ensuring that optical signals can exit the package effectively. The unique overlap of waveguides in different directions enhances signal integrity and transmission efficiency.
This semiconductor package addresses the demand for miniaturization and enhanced performance in electronic components. It supports multi-chip integration, combining different functional chips into a single, compact package. The PIC chip's design ensures that optical signals can be transmitted externally through a strategic pathway involving the second WG, first WG, and transparent support layer. The incorporation of a multi-insulating layer further supports the structural integrity and signal isolation within the package.
The manufacturing process involves several precise steps, including the formation of the transparent support layer, PIC chip, and EIC chip. The optical path bridge chip is strategically placed to align its waveguide with that of the PIC chip. Additional features like reflectors and optical couplers can be integrated to enhance signal direction and coupling with external optical fibers. The process may also involve advanced bonding techniques, such as hybrid copper bonding, to ensure robust connections between components.
By integrating EIC and PIC chips, this semiconductor package is poised to meet the growing demand for high-speed, multifunctional electronic components. It offers a compact solution that supports both electronic and optical communication, making it suitable for advanced electronic devices requiring efficient data transmission. The design and manufacturing innovations provide a pathway for future semiconductor developments, emphasizing reduced form factors and enhanced performance.