US20260163338
2026-06-11
Electricity
H02B1/21
The modular busbar assembly is designed to enhance power density in data center racks by accommodating different power targets and connector interfaces. It offers flexibility by supporting multiple connector geometries within a single, cost-effective setup. The assembly is capable of handling both single and double-pole connectors, with connector contacts positioned variably relative to the busbar, which can be customized independently from the primary busbar geometry.
Increasing data center rack power density poses significant challenges. A projected threefold increase in power density demands a corresponding increase in current delivery, which conventional methods struggle to support due to limitations in connector and busbar designs. Existing solutions like taller connectors, airflow cooling, and liquid cooling are insufficient or impractical for the required power increase. Additionally, using insulators with higher thermal resistance is not viable due to limitations in material properties and availability.
The modular busbar assembly includes a primary positive busbar for carrying positive current and a primary return busbar for negative current. It also features an auxiliary busbar, which can be independently adjusted and coupled to either the positive or return busbar. This auxiliary busbar can be spaced apart to create recesses that can accommodate connectors, enhancing the assembly's flexibility and compatibility with existing hardware.
The assembly's design allows for various configurations. The auxiliary busbar can be brazed to either the primary positive or return busbar, and it may extend parallel to the coupling or non-coupling sides. Recesses formed by these configurations can house connectors, supporting both single and double-pole connections. The design also facilitates the use of copper in the auxiliary busbar for improved conductivity.
The modular busbar assembly provides a scalable solution for increasing power delivery within limited rack space. Its ability to interface with multiple connector types and geometries without requiring extensive modifications makes it a practical choice for data centers aiming to enhance power density efficiently. The assembly's adaptability and compatibility with off-the-shelf hardware further underscore its utility in modern data center environments.