US20260182414
2026-06-25
Electricity
H10W70/65
Technologies for advanced glass-core substrates are introduced, focusing on integrated circuit components featuring a substrate with a glass core. The design includes one or more dies mounted on one side of the glass core and build-up layers on the opposite side. This arrangement offers benefits such as reduced stress between components by matching the coefficient of thermal expansion (CTE) of the glass core to that of the dies. Some configurations incorporate a CTE gradient within the glass core, aligning it with both the dies and the build-up layers.
Glass cores are increasingly used in integrated circuit components and other electronic devices. They serve as a base for build-up layers that connect various dies. A challenge arises when the CTE of the glass core, build-up layers, and dies are not aligned, leading to stress during thermal cycling. This stress can result in cracks or poor connections, impacting the reliability of the electronic components.
The described embodiments feature a glass core substrate with dies on the top surface and build-up layers on the bottom. By matching the CTE of the glass core to that of the dies, thermally-induced stress is minimized. Some designs include a CTE gradient to match the top and bottom components. A bridge interconnect, potentially a thin-film type, may be embedded in the glass core, facilitating high-bandwidth connections between dies.
These technologies allow for flexibility and scalability, enabling high-performance products with improved chip attach yield and reliability. The approaches reduce complexity and support densely packed dies. The combination of features can be tailored to specific needs, leading to a wide range of potential applications.
The document clarifies terminology, ensuring a consistent understanding of terms like "connected," "coupled," and "adjacent." It emphasizes that the disclosed methods and systems are not limited to specific configurations or advantages. The scope includes all novel features and combinations, encouraging modifications and alternatives within the claims.