Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies

Smart overview of the Invention

The patent application describes a targeted jet-cooling system designed to manage heat in high-density computing assemblies, such as those used in zetta-scale computing. The system utilizes multiple coolant jets, each individually adjustable in terms of flow rate, pressure, or angle, to optimize thermal performance. Coolants can be either a dielectric two-phase liquid (JETSTREAM) at atmospheric pressure or supercritical CO2 (JETSCI) in a high-pressure closed-loop. This cooling method effectively handles thermal transport, supporting computing operations from 10 exaFLOPS to 1 zettaFLOPS per rack.

Technical Field

This invention addresses the thermal management challenges in high-power electronic assemblies, specifically focusing on targeted coolant-jet systems. Unlike traditional methods that apply cooling uniformly, this system provides localized, tunable cooling to individual heat sources within wafer- or panel-scale computing modules. Such targeted cooling is crucial for managing the localized hot spots that occur in zetta-scale computing environments, which generate power densities beyond the capabilities of conventional cooling solutions.

System Description

The cooling system comprises multiple coolant jets aimed at specific heat-generating areas within electronic computing assemblies. Each jet is adjustable to maintain a uniform temperature across the system. The jets target exposed surfaces of compute stacks mounted on a monolithic substrate. The system can utilize a dielectric liquid for two-phase immersion cooling or a supercritical fluid like CO2 for enhanced cooling. A flow-control manifold, responsive to temperature sensors, regulates each jet, enabling thermal transport capacities exceeding 100 kW per rack.

Implementation Aspects

A rack-scale computing module includes multiple compute stacks on a single substrate, with a jet-cooling assembly projecting coolant jets onto the stacks' back surfaces. Jets are precisely aligned and can enhance nucleate boiling through etched silicon fins or other microstructures. The coolant options include a dielectric two-phase liquid or supercritical CO2, with each jet independently controlled to ensure temperature uniformity. This setup supports sustained computing throughput at zetta-scale levels.

Method and Benefits

The cooling method involves directing multiple coolant jets toward localized heat sources, tuning each for optimal temperature distribution, and recirculating the coolant within a sealed system. This approach, whether using two-phase or supercritical conditions, ensures reliable operation of high-performance computing assemblies while maintaining practical power budgets. The method offers a scalable solution for managing the thermal demands of exa-to-zetta-scale computing systems.